The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
TL;DR: SK hynix has introduced the world's first 16-Hi HBM3E memory, offering up to 48GB per stack, marking the highest capacity and layer count in HBM memory. This development follows NVIDIA's ...
TL;DR: SK hynix unveiled next-gen HBM4 memory with up to 16-Hi stacks, 48GB capacity, and 2TB/sec bandwidth, targeting NVIDIA's Vera Rubin AI GPUs in 2026. Mass production begins in late 2025, ...
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