Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across ...

From 3D-printed prototypes to immersive game worlds, the demand for 3D content is surging across industries—and with it, the ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Yiqi is a thought leader in Digital Journal’s Insight Forum (become a member). In the rapidly evolving landscape of design, the integration of 3D technology is no longer a niche reserved for animation ...

3D electronics is an emerging manufacturing approach that enables the integration of electronics within or on the surface of objects. While it has long been used for adding antennas and simple ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

Try SAM 3D to create editable 3D models and meshes from images, with manual scale and rotate tools, helping beginners turn ideas into assets ...

Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...