A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, but how fast it can feed itself data. The long-feared “memory wall” is now ...

Researchers have demonstrated the first chip-based 3D printer, a tiny device that emits reconfigurable beams of visible light into a well of resin that rapidly cures into a solid shape. The advance ...

BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...

Most cells in the human body exist in complex three-dimensional environments, yet they are still commonly studied on flat plastic dishes. These two-dimensional cultures distort cell behavior, limiting ...

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

Researchers developed a microfluidic chip with 3D-printed microstructures that moves droplets precisely, captures cells efficiently, and quickly forms cell spheroids for improved lab-grown tissue ...

(Nanowerk News) Imagine a portable 3D printer you could hold in the palm of your hand. The tiny device could enable a user to rapidly create customized, low-cost objects on the go, like a fastener to ...