TOKYO--(BUSINESS WIRE)-- OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...
The production of high-quality three-dimensional assets has long been constrained by the technical expertise and time investment required to create professional-grade models. Hyper3D, the flagship ...
Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...
The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...
A new technical paper titled “System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by researchers at imec, INESC-ID, Université ...
A new technical paper titled “A3D-MoE: Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration” was published by researchers at Georgia Institute of Technology. ...
What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...
Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...
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