Digital Camera World on MSN

The inventor of the CMOS camera sensor just won the Nobel Prize of Engineering

The godfather of the active-pixel CMOS sensor, Eric R Fossum, PhD, has been awarded the 2026 Charles Stark Draper Prize for ...
Digital Photography Review on MSN

Eric Fossum earns the prestigious Draper Prize for pioneering the CMOS image sensor

Image: Draper Eric Fossum, the inventor of the modern CMOS image sensor and a longtime friend of DPReview, was recently ...
Business Wire

Toshiba Releases 16 Megapixel CMOS Image Sensor for Smartphones and Tablets

TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO:6502) today announced the launch of “T4KC3”, a 16 megapixel(MP) BSI CMOS image sensor. Sample shipments are scheduled to start in September this year ...
Business Wire

temi Robot Selects Newsight's NSI3000 CMOS Image Sensor for the temi Personal Robot 3D Vision System

NESS ZIONA, Israel--(BUSINESS WIRE)--temi (www.robotemi.com), developer of advanced personal robot temi has selected Newsight's NSI3000 line sensor for the robot’s 3D visual system. The NSI3000 chip ...
Security

OmniVision in Volume Production With its First 1/4-Inch, 3-Megapixel System-On-A-Chip Sensor

Its OmniPixel (R), OmniPixel2 (TM), OmniPixel3 (TM) and OmniPixel3-HS (TM) CameraChip (TM) products are highly integrated single-chip CMOS image sensors for mass-market consumer and commercial ...
Nature

CMOS Image Sensor Technology

CMOS image sensor technology underpins a wide array of modern imaging applications, ranging from everyday digital cameras to specialised scientific instruments. This technology exploits complementary ...
Optics

MIT camera chip improves views of neural behavior

A project at MIT's Picower Institute for Learning and Memory has developed a sensor chip suited in particular to enhanced imaging of neural activity. Described in Nature Communications, the chip ...
Electronic Design

Surface-Micromachined CMOS Process Enhances IC Tire-Pressure Sensor

An innovative design by Motorola's Sensor Products Division in Tempe, Ariz., optimally integrates a surface-micromachined capacitive automotive tire-pressure sensor with a 0.8-µm CMOS double-metal, ...
Semiconductor Engineering

Die-level Thinning and Integrating Route For Singulated MPW Chips Using Both Silicon Sensors and CMOS Devices

“Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a ...