As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...
To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems.
The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid ...
A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding” was published by researchers at Aalto University in Finland. “The trend ...
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