The rapid adoption of media-rich applications in portable consumer products is requiring progressively higher memory speeds and capacities, especially for volatile memory that stores data during ...

Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

AMD has been featured considerably in new leaks from Moore's Law is Dead, with Tom providing some more details on AMD's next-gen Instinct MI300 accelerator. The new AMD Instinct MI300 accelerator will ...

FREMONT, Calif. — ChipPAC Inc. today announced qualification of 1.2-mm thick same-die-stacked packages, which are expected to be used in next-generation cell phones to include memory for Internet ...

AMD EPYC Milan-X CPU will feature 3D die stacking through its 3D V-Cache technology, according to the most recent leak. Despite the successful release of the EPYC 7003-series, the card manufacturer is ...

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