Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

The rapid adoption of media-rich applications in portable consumer products is requiring progressively higher memory speeds and capacities, especially for volatile memory that stores data during ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

There's a rumored chip on the way from AMD with far more memory bandwidth than anything the company has shipped before. If the rumor is true, Milan-X will offer a mammoth amount of HBM bandwidth.

Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking ...

CHANDLER, Ariz.–Amkor Technology Inc. today announced it has become the first IC assembler to qualify a new series of two-die stacked chip-scale packages (S-CSP) with a low profile of 1.0 mm and light ...

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