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Semiconductor Rivalry Rages on in High-Temperature Chips

This article is part of our exclusive IEEE Journal Watch series in partnership with IEEE Xplore. Two semiconductors—silicon carbide and gallium nitride—are the rivals in a (quite literally) heated ...
EDN

IGBT modules enable high power density

Infineon Technologies AG has launched the new TRENCHSTOP 1700-V IGBT7 chip in the standard EconoDUAL 3 industrial module package. With the new IGBT7 chip technology, the EconoDUAL 3 claims leading ...
EurekAlert!

Fig. 1: The Protochips Fusion heating stage and chip used in the Nion electrical module, which enabled the scientists to conduct controlled high-temperature studies in the ...

Fig. 1: The Protochips Fusion heating stage and chip used in the Nion electrical module, which enabled the scientists to conduct controlled high-temperature studies in the vacuum of the microscope.
TMCnet

Quectel Introduces SH602HA-AP Smart Robotic Computing Module to Power Next Generation of Robotic Devices

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise ...