(Yicai) Jan. 13 -- Forehope Electronic said the Chinese integrated circuit packaging and testing services provider plans to ...

Collaboration expands advanced package testing capabilities in the U.S. BEAVERTON, Ore., Nov. 8, 2022 /PRNewswire/ -- Tektronix Inc., a leading provider in test and measurement solutions, announced ...

Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. Today’s integrated circuit (IC ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

SAN FRANCISCO &#151 IC packaging test specialists Antares conTech Inc. and UMD Advanced Test Technologies Inc. have agreed to merge. Antares (Gilbert, Ariz.) is a provider of high-end sockets and ...

Another common challenge is the time required for verification signoff prior to manufacture. The proven way to avoid this bottleneck and its related impacts is to implement a process and methodology ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive year Taiwan raised ...

The CSIS American Innovation Project Blog brings together key perspectives on the geopolitical and technological challenges of the twenty-first century. Semiconductor Packaging is an extremely ...

EAST AURORA, N.Y.--(BUSINESS WIRE)--Astronics Corporation (NASDAQ: ATRO), a leading provider of advanced technologies for the global aerospace, defense, and semiconductor industries, announced today ...

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...