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Modular packaging for multi-market compliance
Packaging rules rarely line up neatly across borders. Cities pilot deposit return schemes (DRS) ahead of nations, regions mandate different recycling labels, and local bans on specific formats or ...
Marvell Technology MRVL uses advanced CMOS technologies at 5nm and 3nm nodes and is now shifting toward 2nm and below, which include innovations like gate-all-around transistors and backside power ...
The PackWorld modular, flexible concept for robotic packaging is now available with HP series “High-Performance” robots. The modular cell is designed to handle packaging applications that require low ...
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