Stratix 10 DRAM SiP Devices Break Bandwidth Bottlenecks in High-Performance Systems by Efficiently Integrating an FPGA and High-Bandwidth Memory Die into a Single Package San Jose, Calif., November 9, ...

Inapac Technology Inc., announced a breakthrough solution for integrating DRAM into advanced SiP applications. Using its proprietary wafer stress methodology called voltage induced burn-in emulation ...

This product is featured in EDN's Hot 100 products of 2016. See all 100 here. Aiming to break bandwidth bottlenecks in high-performance systems, Altera has unveiled what the company claims to be the ...

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

Different test strategies and methods at wafer probe and package test are needed to accommodate today�s burgeoning SIP technology. The consumerization of the electronics markets continues its rapid ...

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

System-in-a-package technology fulfills the need for high-density, small-footprint products with short turnaround times by using low-cost, standard assembly equipment. Shorter development times and ...

Rambus has taken a new interest in the mobile phone market. The DRAM technology company has acquired a number of patents related to system-in-package (SiP) memory technology aimed specifically at the ...

1. MARKET OVERVIEW Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology Recent Market Activity Growing Demand for ...

Taiwanese DRAM maker ProMOS Technologies expects to start volume production of a memory chip using system in package (SIP) technology for high-end handsets in the second half of 2004, according to ...

Patented Approach Eliminates Memory Burn-In Requirements, Ensuring High Quality and Reliability at the Die Level SAN JOSE, Calif., May 10 /PRNewswire/-- Inapac Technology, Inc., the leading ...