AI agents capable of handling large portions of chip design and verification are less about convenience and more about maintaining a competitive edge globally.

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Unlock the future of semiconductor innovation with chiplets — enabling scalable, cost-effective designs and paving the way ...

PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC ...

Haozhe “Harry” Wang is an assistant professor of ECE and a pioneer in developing new methods for manufacturing nanoelectronic ...

Electronics are everywhere. As daily life becomes more digital and more devices become software defined and interconnected, the prevalence of electronics will inevitably rise. Semiconductors are what ...

Researchers at Pohang University of Science and Technology (POSTECH) have developed an artificial intelligence approach that ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

All of this is prompting chip designers to explore new strategies to dial down the heat. These include using exotic materials like graphene and diamond, incorporating advanced packaging techniques ...

ISM 2.0 will focus on indigenous chip design, startup-led innovation, ecosystem development, and talent creation, with the government targeting 2nm chip manufacturing and allocating Rs 1,000 crore for ...

Navitas Semiconductor's near-term performance is likely to disappoint, attributed to the softer industrial demand and the overconcentration of revenues from China. This is especially since the NVDA ...