Apple executives recently talked about Apple Silicon in an interview, explaining the Neural Engine and the company's chip design process. Laura Metz, the Director of Product Marketing, Anand Shimpi of ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

TL;DR: Synopsys has successfully completed silicon bring-up of its LPDDR6 IP on TSMC's advanced N2P process, delivering up to 86GB/sec bandwidth and significant generational upgrades over LPDDR5. This ...

Johny Srouji, Apple’s top chip executive revealed recently in a private event that the company is exploring the use of generative AI to help speed up the design process for its custom silicon. Here’s ...

A well-repeated truism throughout the semiconductor industry is that chip design verification is complex and often takes up the largest portion of a design project’s schedule –– sometimes as much as ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

Leveraging Tower’s Mature Silicon Photonics Foundry Platform to Enable Scalable FMCW LiDAR. MIGDAL HAEMEK, Israel, and SAN JOSE, CA. – January 05, 2026 – Tower Semiconductor ...

This article is part of the TechXchange: Silicon Photonics. GlobalFoundries believes there is a bright future for chips that harvest the potential of photons, the building blocks of light, instead of ...

Marvell partnership extension builds on long-term deal for AWS Marvell plans to accelerate silicon design and manufacturing AWS continues data center compute upgrades AWS has announced an expansion to ...