FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...
FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
With the industry recovery coming on slowly, cost is a more important factor than ever. Semiconductor manufacturers are constantly under pressure to reduce costs, and during a down cycle they must do ...
WILLOW GROVE, Pa. — Kulicke & Soffa Industries Inc. today announced it has extended its technology licensing arrangement with Amkor Technology Inc. to include wafer-level chip-scale packaging ...
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