The global market for EUV mask blanks was valued at USD 591 million in 2024, and is projected to reach a revised size of USD 1,360 million by 2031, growing at a CAGR of 12.2% during the forecast ...
Lasertec, the sole provider of EUV patterned mask inspection systems, aims for double-digit revenue growth despite a slowdown in sales from China due to US export restrictions. The company has also ...
The fiscal second quarter saw robust growth in IT revenue and margins on EUV mask blank and HDD substrate demand, while Life Care profits declined due to increased promotional spending. The outlook ...
ALBANY, N.Y.--(BUSINESS WIRE)--SEMATECH announced today that researchers have reached a significant milestone in reducing tool-generated defects from multi-layer deposition of mask blanks used for ...
PLAINVIEW, N.Y., Feb. 10, 2022 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that a mask blank supplier to the semiconductor industry has ordered Veeco’s IBD-LDD® Ion Beam ...
TOKYO, Sept. 09, 2025 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the release of its next-generation CD-SEM* E3660, engineered ...
Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as ...
Making high-NA EUV lithography work will take a manufacturing-worthy approach to stitching together circuits or a wholesale change to larger masks. Circuit stitching between the exposure fields is ...
The eBeam Initiative conducted its 14 th annual eBeam Initiative Luminaries survey in July and reported the results on September 23, 2025 to more than 200 attendees at its annual meeting during the ...
EUV Tech (EUVT), a global leader in manufacturing at-wavelength EUV metrology equipment, is excited to announce the next generation of EUV zoneplate microscopy. The AIRES ® (Actinic Image REview ...
Extreme ultraviolet lithography (EUVL) has emerged as a cornerstone technology in the semiconductor industry, enabling the production of devices with sub-10 nm feature sizes. By utilising a 13.5 nm ...
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