Husky Technologies introduces Hylectric and HyperSync molding platforms designed for sustainable packaging production ...

Summary: Our AI Investor Podcast hosts, Eric Bleeker and Austin Smith, have been counting down 12 trends they believe AI ...

Despite the modest expected growth, Camtek shares closed at $162, hovering near their 52-week high of $164.21 and implying a ...

The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance gains are increasingly driven by heterogeneous integration ...

Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...

By Wen-Yee Lee TAIPEI, Feb 5 (Reuters) - ASE Technology Holding, the world's largest chip packaging and testing provider, ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

These companies can pleasantly surprise investors in 2026.

Nvidia Corporation's outlook turns bullish: hyperscaler capex boosts data center growth, with secured HBM4 and TSMC CoWoS capacity. Click for this NVDA stock update.

OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting ...

Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced better-than-expected revenue in Q4 CY2025, but sales fell by 2.1% year on year to $7.01 billion. On top of that, next ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.