Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today entered into the high-speed ...
Credence Systems has introduced the GlobalScan-I, an IC diagnostic system that performs physical device analysis to pinpoint process performance yield problems. The company claims that GlobalScan-I ...
The power-performance-area (PPA) metric and time-to-market of modern system-on-chips (SoCs) are dominated by two major issues: on-chip interconnects and layout parasitics. Especially, as the industry ...
G'day all,<P>I recently discovered the iC (internet Commit driver) program [/URL]iC Review<BR> that allows you to play Duke3D over the net or a tcp/ip network.<P>It installed and everything and I ...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results