JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Investing.com -- Intel is positioning its Embedded Multi-die Interconnect Bridge-T, or EMIB-T, as a potential alternative to ...

Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

MediaTek Inc (聯發科), the world’s biggest smartphone chip supplier, yesterday said it plans to double investment in data center-related technologies, including advanced packaging and high-speed ...

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Remote Renesas board farm established enabling designers to begin programming and coding – free – on Day 1 of new MCU launch Comments Neb Matic, MIKROE’s CEO: "We are very excited about this ...

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control ...

All of this is prompting chip designers to explore new strategies to dial down the heat. These include using exotic materials like graphene and diamond, incorporating advanced packaging techniques ...

As highlighted by Towards Packaging research, the global specialty cartons market, valued at USD 66.87 billion in 2025, is expected to reach USD 106.46 billion by 2035, registering a CAGR of 4.76% ...

STMicroelectronics has introduced the Stellar P3E, the first automotive microcontroller with built-in AI acceleration for real-time edge intelligence, aimed at software-defined vehicles and X-in-1 ECU ...