With the ESP32-P4 not having any wireless functionality and instead focusing on being a small SoC, it makes sense to combine it with a second chip that handles features like WiFi and Bluetooth.
However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...
Last year, Semtech released the LR2021 LoRa Plus transceiver chip, designed to address the low data-rate issue associated with LoRa, but surprisingly, ...
Abstract: This paper introduces the design and implementation of an RF-based system for detecting non-cooperating unmanned aerial vehicles (UAVs). The system comprises an RF module, an automated Pan ...
Abstract: This letter presents a low-profile module-integrated single-antenna concept for the unlicensed 60 GHz band that simultaneously provides wide beam coverage in both the E and H planes and ...
This is a remix of mbarszcz-pcb's version of a C64 RF Modulator replacement based on the schematics of similar designs like Zero-X/OMS's Modified Commodore RF ...
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