Designed to power 12V ground-connected loads, the VNQ9050LAJ is compatible with 3V and 5V logic signals. Built with ST’s ...
Standard and wide package options meet isolation, insulation, and creepage/clearance specifications STMicroelectronics ...
The FiRa® Consortium today announced the launch of FiRa Plugfests, a new industry initiative designed to accelerate ultra-wideband (UWB) interoperability through hands-on, real-world testing and ...
New ST-patented hybrid mode relieves software development for USB PD advanced features; Updated ST-proprietary ...
Amtech Systems soars 94% in six months, but falling estimates, pricing pressure and cyclical risks signal the rally may be running out of steam.
Combined with Tower’s multi-site global footprint, Scintil’s unique SHIP™ platform is ready to take on the challenging ...
The device complies with the latest LV124 requirements, one of the automotive industry’s most stringent benchmarks for electrical and electronic component robustness. It is intended for 12V ...
The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% ...
Dukosi announce its presence at Embedded World 2026. Continuing its partnership with Arrow Electronics Dukosi will be showcasing the DKCMS ...
Stanley Druckenmiller's Duquesne Family Office initiated a position in Goldman Sachs (GS) and exited Meta Platforms (META) in ...
This represents a significant jump from the $128 billion spent in 2025, with the bulk earmarked for scaling AI capabilities. The central question among investors is the timeline for realizing a ...
The Vatican will open new parts of St. Peter’s — including the full terrace — and roll out a ‘SmartPass’ digital entry system as it marks the basilica’s 400th anniversary.
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