Mike Ellow, CEO of Siemens EDA, outlines the company’s ambitions for AI-powered digital twins that recreate every part of a design from semiconductors on out.

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Audinate Group Limited ( AUDGF) Q2 2026 Earnings Call February 15, 2026 6:30 PM EST ...

Transformer Weekly: Anthropic’s political donations, energy bills policy, and an xAI exodus ...

Arm’s speciality is general-purpose chips called central processing units ( CPU s). Its power-efficient designs have proved ...

A new microscale gas chromatography system integrates all fluidic components into a single chip for the first time. The design leverages three Knudsen pumps that move gas molecules using heat ...

The breakthrough builds on neuromorphic engineering, a field that designs hardware modeled after the human brain. Unlike traditional processors, which separate memory and computation, neuromorphic ...

AI is expensive. This Microsoft-backed chip startup says its can generate AI answers 90% cheaper ... and it's going to get even better over time ...

OpenAI launches GPT‑5.3‑Codex‑Spark, a Cerebras-powered, ultra-low-latency coding model that claims 15x faster generation speeds, signaling a major inference shift beyond Nvidia as the company faces ...

Discusses Tech Transitions and the Unique Aspects of the AI Era February 17, 2026 12:30 AM ESTCompany ParticipantsNandan Nilekani ...