Electronic Design

Empower Unveils High-Density Silicon Capacitors for Co-Packaging with AI Chips

Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.
Electronic Design

What’s the Difference Between Lateral and Vertical Power Delivery?

Delve into the details of vertical power delivery and how it surmounts the limits of traditional lateral power when it comes to supporting secondary power rails.
Electropages

High-density embedded silicon capacitors advance next-gen AI and HPC performance

“Our customers are under intense pressure to deliver greater performance with tighter power margins,” said Steve Hertog, senior vice president of Worldwide Sales, Empower Semiconductor. “These new ...
IEEE

Capacitance Modeling With Charge Partitions Covering Full-Region Operations of TFETs

Abstract: An accurate physics-based capacitance model is developed covering full-region operations of silicon TFET (Si-TFET) with all biasing conditions. The intrinsic and parasitic capacitances are ...
IEEE

Comprehensive MOSFET Capacitance Characterization Based on Charge Trajectories

Abstract: A novel method for determining the parasitic capacitance of power MOSFETs is proposed. Unlike conventional methods that rely on small-signal measurements under specific bias conditions, the ...