The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

Amazon today announced the general availability of Amazon Lookout for Vision, a cloud service that analyzes images using computer vision to spot product or process defects and anomalies in ...

A research team affiliated with UNIST has unveiled an innovative, high-precision AI-powered quality inspection system that reduces inspection time from 12 minutes to just under 3 seconds. This cutting ...