Midmo today announces the launch of its Edge Intelligence (Ei) module suite, introducing a new, modular approach to ...
The LPCAMM2 design is part of an ongoing effort to replace soldered LPDDR in mobile and ultra-thin systems with memory that is both upgradeable and space-efficient.
The new parts aren't in mass production yet, but they'll likely replace most consumer RAM in the coming years.
congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series SAN DIEGO, CA, UNITED STATES, January 20, 2026 ...
Tria Technologies has introduced a new Open Standard Module designed to support high‑performance, low‑power edge computing and artificial intelligence workloads. Compact OSM-LF-IMX95 module Credit: ...
The next member of Motorola's ever-expanding Edge 70 family will be the Edge 70 Fusion, which ran Geekbench last week and had its specs leaked before that. Today, it's the star of newly leaked ...