Renesas announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process at the ISSCC 2026.

Southeast Asia and India will likely emerge as volume-based back-end assembly and test hubs, specializing in select areas of the back-end processes.

As memory prices keep climbing, understanding AI-driven demand, US–China controls, and input costs is essential for ...

Looking ahead to Q1 and the anticipated seasonal impact from the Luna New Year holiday, we expect electronics and packaging revenue to be up slightly sequentially and to increase in the low 20% range ...

Micron management is pointing output to high-margin segments, notably HBM and data centers. Read why MU stock is upgraded to Strong Buy.

Elad Raz, CEO of NextSilicon, is an experienced entrepreneur and technology leader widely respected for his deep expertise in low-level systems, security, networking, and file-system development. Over ...

Without ultra-purity, we cannot achieve the performance needed in today's world. When wafers or electronic components become ...

Axcelis Technologies, Inc. (NASDAQ:ACLS) Q4 2025 Earnings Call Transcript February 17, 2026 Axcelis Technologies, Inc. beats ...

Q1 2026 Earnings Call February 18, 2026 10:00 AM ESTCompany ParticipantsJeff Ambrosi - Head of Investor Relations & ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

Last year we reported that the Japanese giant had obtained enough RAM to shield it from the price increases in the short-term ...

With DDR5 prices quadrupling as AI demand drains supply, we tested CXMT Chinese memory to see how it stacks up against premium and budget kits in gaming.